Intel Nova Lake CPUs might lastly convey a 3D V-Cache rival to desktop gaming

Rumor mill: Since their launch in early 2022, AMD’s X3D CPUs have turn into the most-sought after CPUs for PC players who need high efficiency, thanks largely to their 3D V-Cache know-how, which permits greater body charges and smoother gameplay. Intel is now reportedly planning to counter AMD’s current dominance in high-end gaming by incorporating comparable know-how in its upcoming Nova Lake CPUs.

In response to tipster @Haze2K1, at the very least two SKUs within the Nova Lake lineup will ship with increased L3 cache. Intel calls the brand new know-how “bLLC,” which is brief for “massive Final Line Cache.” The leaker added that each SKUs with bLLC will characteristic 8 P-cores and 4 LP-E cores. One might be paired with 20 E-cores, whereas the opposite will embrace solely 12. Each chips are anticipated to have a 125W TDP.

bLLC is an integral a part of Intel’s newest Clearwater Forest server CPUs, however the firm has to this point denied plans to convey the know-how to its shopper lineup.

In a November 2024 interview with YouTubers der8auer and Bens {Hardware}, Intel’s Tech Communications Supervisor, Florian Maislinger, said that Crew Blue had no plans to introduce a 3D V-Cache-like know-how in its desktop processors.

8p, 16e
8p, 12e

Each 4lpe, bLLC, 125w https://t.co/EQo4MiaGpq

– Haze (@Haze2K1) June 17, 2025

Within the Clearwater Forest chips, the native cache is built-in into the bottom tile, which sits beneath the lively tiles and acts as an interconnect. Including extra cache to the bottom tile would make the Nova Lake processors structurally just like AMD’s 9000-series X3D chips, which additionally characteristic V-Cache connected to the underside of the CPU dies.

Intel’s future lineup will reportedly be led by the flagship Core Extremely 9 485K with 52 cores and a 150W TDP, whereas the entry-level chip is anticipated to be the Core Extremely 3 415K, that includes 12 cores and a 125W TDP.

Within the first two generations of X3D, AMD positioned the V-Cache on high of the CPU chiplets, which led to poor thermals and throttled clock speeds. With its third-generation X3D lineup, AMD moved the V-Cache beneath the chiplets, enhancing each thermal efficiency and clock conduct.

Nova Lake-S is anticipated to launch in late 2026 or early 2027 and is rumored to incorporate at the very least six desktop SKUs. The lineup will reportedly be led by the flagship Core Extremely 9 485K with 52 cores and a 150W TDP, whereas the entry-level chip is anticipated to be the Core Extremely 3 415K, that includes 12 cores and a 125W TDP. The processors are additionally tipped to make use of the all-new LGA 1954 packaging and a brand new socket.